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dc.contributoren-US
dc.creatorA.E., Kurnosenko
dc.creatorD.I., Arabov
dc.date2017-10-16
dc.date.accessioned2018-02-23T17:16:28Z
dc.date.available2018-02-23T17:16:28Z
dc.identifierhttps://knepublishing.com/index.php/KnE-Engineering/article/view/1111
dc.identifier10.18502/keg.v2i3.1111
dc.identifier.urihttp://ridda2.utp.ac.pa/handle/123456789/4347
dc.identifier.urihttp://ridda2.utp.ac.pa/handle/123456789/4347
dc.descriptionThis article considers the assembly technology of three-dimensional molded interconnect devices (3D MID). The problem of performance optimization for dispensing and component placement operations is explored. Optimization is assumed on the reduction of the auxiliary time of the dispensing/placement head and manipulator have to spend traveling through all component mounting positions. The problem is defined as the traveling salesman one. The article zeroed in distance/time matrix determination for dispensing/placement head and manipulator three-dimensional movements in the case of the selected kinematics diagram of the assembly equipment. Formulas for determination of this matrix are proposed, formal description of the optimization problem is presented, and a brief review of problem-solving methods is described.en-US
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dc.languageeng
dc.publisherKnE Publishingen-US
dc.relationhttps://knepublishing.com/index.php/KnE-Engineering/article/view/1111/2640
dc.rightsinfo:eu-repo/semantics/openAccess
dc.rightshttps://creativecommons.org/licenses/by/4.0/
dc.source2518-6841
dc.sourceKnE Engineering; Breakthrough directions of Scientific Research in NRNU MEPhI: Development Perspectives in the Framework of the Strategicen-US
dc.titleOptimization of Electronic Components Mounting Sequence for 3D MID Assembly Processen-US
dc.typeinfo:eu-repo/semantics/article
dc.typeinfo:eu-repo/semantics/publishedVersion


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